Memory Mac
Xigmatek's MAC-S3501 memory heatspreaders are intended for DDR, DDR2 and DDR3 memory modules, and assuming the sticks of memory you have are bare, installation is a quick affair. A thin strip of jelly silicon thermal interface is laid down on the DRAM, and then the anodized aluminum Xigmatek MAC-S3501 heatspreaders are set in place. If on the other hand your memory already has heatspreaders that are attached with adhesive or frag tape, there's a good chance you may destroy your memory if you attempt to remove the heatspreaders.
Our experience removing heatspreaders from old memory has been successful when the DRAM is the TSOP-II formfactor, and the adhesive isn't too sticky. Most early DDR2 DRAM was TSOP-II, and almost every DDR DRAM we've come across is. Later generation DDR-II, and DDR3 is packaged in a BGA IC formfactor. That kind of RAM package doesn't suffer flexing very well, and we've destroyed some very expensive memory attempting to remove heatspreaders.
Xigmatek's MAC-S3501 RAM heatspreaders are easy to install on bare DDR or DDR2 memory modules, and will likely improve memory cooling over passive heatspreaders by some degree. The 30mm fan is powerful enough to ensure moderate air movement between the two aluminum surfaces, noise isn't an issue.
Based on our experiences, we do NOT recommend removing heatspreaders from DDR2/DDR3 memory that use BGA DRAM packaging, it's just too easy to damage the RAM. Unfortunately, that difficulty removing pre-installed memory heatspreaders limits your options if you believe memory cooling is an issue inside your PC. Fragtape isn't as effective as true thermal interface material, mostly because fragtape isn't capable of filling the space appropriately.. but if that's what has been used you're basically stuck.
In our opinion, after market RAM heatspreaders are a luxury item with limited usefulness. A well positioned 120mm or 92mm fan will do wonders for memory temperatures in most situations. Xigmatek's MAC-S3501 RAM heatspreaders seem to be well thought out, but I suspect it's a bit of a catch-22. Modern DDR2 modules will most likely already have heatspreaders, and older generation bare sticks of memory generally don't require anything more than decent airflow. If you disagree with this point of view, take comfort in the fact that Xigmatek supply silicon-based thermal interface pads, not double sided tape.
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